Power chips are connected to exterior circuits through packaging, and their performance relies on the support of the packaging. In high-power circumstances, power chips are typically packaged as power modules. Chip interconnection describes the electrical connection on the upper surface area of the chip, which is typically light weight aluminum bonding cable in standard modules. ^
Typical power module plan cross-section
At present, industrial silicon carbide power modules still mostly make use of the packaging technology of this wire-bonded typical silicon IGBT module. They face problems such as large high-frequency parasitical criteria, inadequate heat dissipation capacity, low-temperature resistance, and not enough insulation stamina, which restrict using silicon carbide semiconductors. The display screen of outstanding efficiency. In order to solve these problems and fully make use of the substantial possible benefits of silicon carbide chips, many brand-new product packaging innovations and solutions for silicon carbide power components have actually emerged recently.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cords to copper wires, and the driving force is expense reduction; high-power gadgets have developed from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The higher the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared to traditional bonding product packaging approaches, Cu Clip innovation has the following benefits:
1. The connection between the chip and the pins is constructed from copper sheets, which, to a particular extent, replaces the conventional cable bonding approach in between the chip and the pins. As a result, a special bundle resistance worth, greater existing flow, and far better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can fully save the expense of silver plating and inadequate silver plating.
3. The product appearance is entirely regular with regular items and is mainly used in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power products, and other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding method is a lot more costly and intricate, but it can achieve far better Rdson and better thermal effects.
( copper strip)
Copper sheet plus cable bonding method
The source pad utilizes a Clip approach, and eviction uses a Cord approach. This bonding technique is somewhat less costly than the all-copper bonding method, saving wafer location (appropriate to really little gateway locations). The procedure is simpler than the all-copper bonding technique and can get better Rdson and much better thermal effect.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper solution, please feel free to contact us and send an inquiry.
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